GreenArrays^™

Product Data Book DB003 Revised 9/26/11

Evaluation Board

Reference Manual

for EVB001 rev 0.1.1

with G144A12 chips

The GreenArrays EVB001 Evaluation Board is a versatile and powerful application development

platform for the GA144-1.20 chips. As such it has many configuration options. The current Printed

Circuit Board (PCB) revision shown on the silkscreen is 0.1.1, and it is currently shipped with a starter

eForth that may be booted from flash.

Please familiarize yourself with this information before using the Eval Board so that you will be aware

of the many configuration options available to you.

In addition, please download and read the other relevant documentation such as the Programmers'

Reference for the F18 computers (DB001), the G144A12 Chip Data Book (DB002), and the User's

Manuals for arrayForth™, eForth, polyFORTH®, and other Application Notes as appropriate. The

current editions of all GreenArrays documents, including this one, may be found on our website at

http://www.greenarraychips.com .

It is always advisable to ensure that you are using the latest documents before starting work.

DB003 Evaluation Board Reference for EVB001

Contents

1.

Introduction ..............................................................................4

Status of Data Give n ........................................................................................4

Documentation Conventions............................................................................4

Numbers .............................................................................................................. 4

Node coordinates................................................................................................. 4

Register names..................................................................................................... 4

Bit Numbering...................................................................................................... 4

2.

Basic Architecture......................................................................5

Highlights ........................................................................................................5

Simplified Block Diagram.................................................................................6

Header Orientation..........................................................................................6

Board Floorpla n ...............................................................................................7

Software Support.............................................................................................7

3.

Power Configuration..................................................................8

Main 1.8v Bu s ..................................................................................................8

External DC Supplies ........................................................................................8

Power Selection and Measurement .................................................................8

Other Available Voltage s .................................................................................8

4.

USB Interfaces ...........................................................................9

4.1

4.2

4.3

Interface Devices .............................................................................................9

Jumpers and Connections ................................................................................9

Flash Configuration .........................................................................................9

5.

Host Chip.................................................................................10

Reset Control .................................................................................................10

Serial Interface s .............................................................................................10

SPI Bus and Devices .......................................................................................11

SPI Flash and Booting......................................................................................... 11

MMC Card Mass Storage ................................................................................... 11

Enabling MMC Card Selection............................................................................ 11

Connecting MMC Power and Signals to SD Socket ............................................ 12

SRAM.............................................................................................................12

Connections to Target....................................................................................12

Summary of Host Pin Usage...........................................................................12

Committed by Layout......................................................................................... 12

Uncommitte d ..................................................................................................... 12

Conditionally Available ...................................................................................... 12

2

DB003 Evaluation Board Reference for EVB001

6.

Target Chip ............................................................................. 13

6.1

6.2

6.3

Reset Control .................................................................................................13

Serial Interface...............................................................................................13

Host Chip Communications ............................................................................13

7.

Prototyping Area..................................................................... 14

Plated-through Hole Gri d ...............................................................................14

Power, Ground and Signal s ............................................................................14

Convenience Circuits ......................................................................................14

Optional Connector Hole Patterns..................................................................15

DB9 Connectors ..................................................................................................15

General-Purpose LEDs ........................................................................................15

VGA Connector ...................................................................................................15

USB Connecto r ....................................................................................................15

RJ48 Connecto r ...................................................................................................15

Audio Connectors ...............................................................................................15

SMA RF Connectors ............................................................................................15

Optional use of SD socket ..............................................................................16

Expanding the Prototyping Are a ....................................................................16

7.6

8.

Physical Documentation.......................................................... 17

8.1

8.2

Bill of Materials .............................................................................................17

GA144 Signal map .........................................................................................18

Host Chip.............................................................................................................18

Target Chip..........................................................................................................20

Connector Pinouts..........................................................................................22

Power Control Section ........................................................................................22

USB Serial Interfaces...........................................................................................22

Host Chip.............................................................................................................23

Target Chip..........................................................................................................23

Prototyping Area.................................................................................................24

Errata.............................................................................................................26

Schematics and Layout ..................................................................................26

Data Book Revision History ..................................................... 35

3

DB003 Evaluation Board Reference for EVB001

1. Introduction

This is the primary reference manual for the EVB001 Evaluation Board. With two GreenArrays G144A12 chips,

peripherals sufficient for a complete software and hardware development environment, and a large prototyping area,

this highly configurable board is intended to serve both engineers and programmers well in evaluating our chips in all

stages of application development.

Initially shipped with eForth in flash, this board is field upgradable with additional system software, such as

polyFORTH®. In addition, our Application Notes will use this board as their default platform so that our customers may

make immediate use of the hardware and software solutions published in those exercises.

1.1 Related Documents

This book describes an application of GreenArray chips, in particular the GA144. In the interest of avoiding needless

and often confusing redundancy, it is designed to be used in combination with other documents.

The general characteristics and programming details for the F18A computers and I/O used in the GA144 are described

in a separate document; please refer to F18A Technology Reference. The boot protocols supported by the chip are

detailed in Boot Protocols for GreenArrays Chips. The configuration and electrical characteristics of the chip are

documented in G144A12 Chip Reference. The current editions of these, along with many other relevant documents

and application notes as well as the current edition of this document, may be found on our website at

http://www.greenarraychips.com . It is always advisable to ensure that you are using the latest documents before

starting work.

1.2 Status of Data Given

The data given herein are Production, reflecting board revision 0.1.1.

1.3 Documentation Conventions

1.3.1 Numbers

Numbers are written in decimal unless otherwise indicated. Hexadecimal values are indicated by explicitly writing

“hex” or by preceding the number with the lowercase letter “x”. In colorForth coding examples, hexadecimal values

are italicized and darkened.

1.3.2 Node coordinates

Each GreenArrays chip is a rectangular array of nodes, each of which is an F18 computer. By convention these arrays

are represented as seen from the top of the silicon die, which is normally the top of the chip package, oriented such

that pin 1 is in the upper left corner. Within the array, each node is identified by a three or four digit number denoting

its Cartesian coordinates within the array as yxx or yyxx with the lower left corner node always being designated as

node 000. Thus, for a GA144 chip whose computers are configured in an array of 18 columns and 8 rows, the numbers

of the nodes in the lower right, upper left, and upper right corners are 017, 700, and 717 respectively.

1.3.3 Register names

Register names in prose may be used with or without the word "register" and are usually shown in a bold font and

capitalized where necessary to avoid ambiguity, such as for example the registers T S R I A B and IO or io .

1.3.4 Bit Numbering

Binary numbers are represented as a horizontal row of bits, numbered consecutively right to left in ascending

significance with the least significant bit numbered zero. Thus bit n has the binary value 2ⁿ. The notation P9 means bit

9 of register P, whose binary value is x200, and T17 means the sign (high order) bit of 18-bit register T.

4

DB003 Evaluation Board Reference for EVB001

2. Basic Architecture

The purpose of this board is to facilitate evaluation and application prototyping using GreenArrays chips. Because no

single I/O complement would be suitable for all likely uses, this board has two GA144 chips: One (called "Host")

configured with sufficient I/O for intensive software development, and the other (called "Target") with as little I/O

committed as possible so that pure, dedicated applications may be prototyped.

2.1 Highlights

Three FTDI USB to serial chips provide high speed (960 kBaud) communications for interactive software development

and general-purpose host communications.

An onboard switching regulator takes power from the USB connectors and/or a conventional "wall wart" power supply.

Whichever of these is offering the highest voltage is used by the regulator.

A barrier strip provides for connection of bench power supplies. Each of the power buses of the two GA144 chips may

selectively be run from external power in lieu of the onboard regulator, allowing you to run either chip from any

desired V_DDvoltage and also facilitating current measurements.

The Host chip is supplied with an SPI boot flash holding 1 MByte of nonvolatile data, an external SRAM with 1 MWord

(2 MBytes) of memory; and may optionally use a dual voltage MMC card such as the 2 Gigabyte unit we have selected

for in-house use. These memory resources may be used in conjunction with Virtual Machines such as eForth and

polyFORTH, or for direct use by your own F18 code.

The Target chip is committed to as few I/O connections as possible. The sources for its reset signal are fully

configurable, and with the exception of a SERDES line connecting it with the Host chip, all other communications (two

2-wire serial interfaces) may be disconnected so that the chip is fully isolated and thus all practical I/O is available for

any desired use.

Roughly half the board is prototyping area, mainly populated with a grid of plated through holes on 0.1 inch centers.

By soldering suitable headers to this grid, you can provide for expansion using various prototyping fixtures such as

those made by SchmartBoard. The grid is intentionally large enough to support an 8- or 16-bit PC-104 socket.

The periphery of the prototyping area is provided with hole patterns for many popular connectors, and there are six 8-

bit bidirectional level shifters for interfacing with external circuits that may not run on 1.8v. In addition, one 1.8v 2-

input OR and three NANDs are available for use in external circuitry.

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DB003 Evaluation Board Reference for EVB001

2.2 Simplified Block Diagram

WALL

WART

SWITCHING

REGULATOR

708.1/17

PORT C

FTDI CHIP

USB

PORT C

USB

TARGET

GA144

USB

RTS

300.1/17

1.8V BUS

2A MAX

USB

CHIP 1

001.

RESET 1

RESET 0

1/17

RESET

10KΩ

.01 UF

OPTIONAL

1.8V

MMC

2GB

10KΩ

.01 UF

500.17

RTS

RESET

701.

1/17

1 MBYTE

SPI FLASH

(VM)

4

PORT A

FTDI CHIP

USB

HOST

GA144

300.1/17

708.1/17

PORT A

2 MBYTE

SRAM

(VM)

USB

PORT B

200.17

100.17

40

CHIP 0

PORT B

FTDI CHIP

As delivered, Host chip boots a Virtual Machine such as eForth or polyFORTH from

flash and talks to terminal on RS232 port B. Ports A and C are available for IDE

operations on Host and Target chips. Target may be fully isolated from Host with the

exception of the SERDES connection. Other software options including other Virtual

Machines besides eForth will be available for field upgrade.

2.3 Header Orientation

For all single-row headers or hole patterns, pin 1 is at the left as viewed from the top side of the board with USB

connectors in the upper left corner; for single column patterns, pin 1 is at the top. For headers with 2 pin short

dimensions, pin 1 will be in the lower left corner for horizontally oriented patterns and in the upper left corner for

vertical patterns. In the special case of 2x2 patterns, pin 1 is always in the upper left corner. The following diagrams

illustrate these orientation conventions and pin numbering:

1

2

3

1

2

3

2

1

4

3

6

5

1

3

5

2

4

6

1

3

2

4

6

DB003 Evaluation Board Reference for EVB001

2.4 Board Floorplan

This overhead image of the evaluation board shows the spatial relationships among the subdivisions that are discussed

in the following sections.

2.5 Software Support

This board is supported by four major classes of software:

1. arrayForth is presently the principal tool for creation of native code, or microcode, to run directly on the F18

computers in our chips. Included are compilers, simulators, an Interactive Development Environment (IDE),

and boot stream generator. arrayForth maintains F18 source code in colorForth notation. The arrayForth

system itself is written in and runs on colorForth, which may be run on a wide variety of platforms.

2. Virtual Machines running in clusters of F18 nodes support high level programming environments whose

natures imply external memory resources. Examples are eForth and polyFORTH. These environments may

interact with microcode running in the rest of the chip, supervising their high performance activities. Some

environments may also support development of native F18 code as a supplement or complement to

arrayForth.

3. Host platform applications, such as enhanced terminal emulators, may be supplied with the virtual machines

or other applications that use them.

4. Applications provided for this board will include source code for arrayForth and/or for specific Virtual

Machines, and often hardware configuration or modification instructions, as appropriate.

Software options for GreenArrays chips and boards are continually being developed, and may be obtained from our

website.

7

DB003 Evaluation Board Reference for EVB001

3. Power Configuration

You must ensure there is enough power for the intended use of the

board. Minimal USB (80% of 440 mW) is sufficient for eForth or

polyFORTH and many typical projects, but power requirements can

exceed 400 mW for V_DDC (core power) if enough F18A computers are

busy simultaneously, and likewise V_DDI (I/O power) can be greater than this depending on what you connect to the

chips. Several power sources are available in the upper left corner of the board.

3.1 Main 1.8v Bus

Primary 1.8v power is supplied by an onboard fixed voltage regulator fed by an optional “wall wart” (type N plug,

positive center conductor, voltage at the J2 connector 3.6 to 19.5VDC with recommended minimum of 4.0V) and up to

three USB connectors. Each source is diode protected from the others so whichever one is supplying the highest

voltage will be the one that is used at any given time; these diodes have an internal drop of 200 to 300 mV. Each USB

connector communicates with a USB host using an FTDI chip. The power available from each USB connection varies

from a minimum of 100 mA at 4.4V to the maximum of 500 mA at 5V; the FTDI chips are configured to request

permission to use the maximum to improve flexibility. An efficient (≈78%) switching regulator produces a maximum of

2A at 1.8V for the logic circuitry on the board. If this full rated power is needed, a "wall wart" capable of delivering 4.5

to 5 watts will be required (efficiency varies with voltage.)

The main 1.8v bus is used to power our side of the FTDI chips, the SPI flash, the Host chip's external SRAM, and the two

logic chips used in SPI bus multiplexing. This bus is also the default source of V_DDC, V_DDI and V_DDA for the Host and

Target chips. Finally it is available to power the SD/MMC socket, the level shifter chips, and is routed for easy

availability in the prototyping area.

3.2 External DC Supplies

Barrier strip J1 provides for connecting up to five independent external power sources to this board, three of

which are free for your use and wiring at J4, J5 and J6, while two have defined uses. Pin 1 may be used as an

alternate source for any of the Target chip's V_DDbuses. Pin 3 may be used as an alternate source for the

Host chip's V_DDC and/or its V_DDI and V_DDA. This facilitates operating either or both of the chips at any desired

supply voltage. It also provides for applications that require more than 2A of 1.8v.

3.3 Power Selection and Measurement

Five 3-pin headers allow selection of either the main 1.8v bus or an external supply as shown in this table:

Header

J10

J11

Chip

Host

Bus

Pins 1-2 connected

J1 pin 3

Pins 2-3 connected

V_DD

C

V_DDI/A

J14

J15

J16

V_DD

C

I

A

Main 1.8v Bus

Target

J1 pin 1

Current may be measured by inserting a shunt or other type ammeter across the desired pair of pins. Some

combinations of current and shunt resistance will require use of an adjustable external power supply to give the

desired voltage on the chip side of the shunt. The jumpers provided are rated at 3A with max resistance of 20 mΩ.

3.4 Other Available Voltages

An unregulated V_CCis input to the onboard switching regulator. No contact is provided because the voltage is not

controlled. Each FTDI chip that is connected to a USB host can provide up to 50 mA of 3.3v, made available on J7, J12

and J19 for ports A, B and C respectively.

8

DB003 Evaluation Board Reference for EVB001

4. USB Interfaces

Three USB device interfaces provide for high speed communications with the GA144 chips. To a host computer each of

these normally appears as an asynchronous serial (COM) port. Although each has a specific planned use on this board,

their configuration is highly flexible.

4.1 Interface Devices

The devices provided are FT232R chips made by Future Technology Devices International, Ltd. (FTDI). As USB to serial

UART devices, their USB side is powered by V_CCfrom the USB host while the side which talks to our chips is powered by

the main 1.8v bus regulated on the board. Because the FTDI chips communicate with the GA144s directly using 1.8v

CMOS, signals are crisp enough that each interface can run at an effective speed of 921,600 baud.

4.2 Jumpers and Connections

Transmit and receive lines are routed to the Host and Target GA144 chips as

described in later sections. Request to Send (RTS) signals from ports A and C

are available for chip reset purposes. RTS from port B is available at plated

through hole J24.

Each FTDI chip is configured to drive transmit and receive activity LEDs D2,

D4, D7, D9, D10 and D11 respectively. The remaining three configurable

outputs, and the DTR signal, are available at hole patterns J8, J13 and J17 for

ports A, B and C respectively. By default two of these outputs are

configured with clock signals that may be used for time base purposes.

Each FTDI chip develops 3.3v for internal use. Plated through holes J7, J12 and J19 provide access to this supply from

ports A, B and C respectively; up to 50 mA may be drawn from each of these for your circuitry if needed.

4.3 Flash Configuration

We configure the FTDI FT232RQ chips before shipping the boards by setting the polarities of TXD, RXD and RTS- lines

correctly and by selecting our default outputs for the five CBUS lines as follows: CBUS0 and 1 are incoming and

outgoing activity LED drivers respectively. CBUS2 and 3 are driven with clock frequencies generated by the FTDI chips.

CBUS4 is also driven with the incoming activity signal as a work-around for one of the rev 0.1.1 board errata.

Signal Location

FTDI

Signal

Definition

Driven low to indicate inbound ("TX") line activity.

Port A

Port B

(LED)

J13.1

J13.2

J13.3

Port C

CBUS0-

CBUS1-

CBUS2-

CBUS3-

CBUS4-

(LED)

J8.1

(LED)

J17.1

J17.2

J17.3

Driven low to indicate outbound ("RX") line activity.

Clock output, 6 MHz.

J8.2

J8.3

Clock output, 48 MHz.

Driven low to indicate inbound ("TX") line activity.

Data terminal ready. Default state and polarity depend on

driver software and configuration.

DTR-

J8.4

J13.4

J17.4

The FTDI chips are specially configured for their use on this board. Excellent documentation as well as configuration

utilities and drivers are available from the manufacturer at http://www.ftdichip.com/. Template files are included in

the software distribution. Please contact us before changing the configuration of your FTDI chips.

9

DB003 Evaluation Board Reference for EVB001

5. Host Chip

The Host chip, designated chip 0 on some of the design

documentation, is by default configured as a development system

including hardware and software support for a high level language

such as eForth or polyFORTH. The photo to the right shows the

section of the board housing this powerful system including 144 F18

computers, two USB serial ports, 1 Megaword (2 MBytes) of

external SRAM, 8 megabits (1 Mbyte) of bootable SPI flash, and

optional provision for using a dual voltage MMC card as onboard

mass storage. All connections make use of software defined I/O

with minimal or no external circuitry. For example, U9 and U10 are

included only to facilitate selection of multiple SPI devices.

Most host pins, other than those used to control SRAM, are

available at jumper stakes or hole patterns such as J21 and J27.

Several probe points are provided: WE-, CE-, A00 and D00 show

SRAM timing; SS, SCK, DO and DI show signals at the SPI flash chip.

S1 and S17 may be used, with great care, to probe the SERDES connection between Host and Target chips.

5.1 Reset Control

The board has two circuits to generate power-on and pushbutton reset signals,

one each for the Host and Target chips. For the Host, this signal terminates at

jumper block J20 along with the RTS signal from USB port A (normally used for

IDE operations on the Host.) By setting jumpers appropriately, the Host chip may

be reset by either, both, or neither of these signals according to the following

table:

J20 Pins

1

3

2

4

J20 pins

None

1-3

Reset Source

User provided inputs on pins 1 or 2

USB port A RTS signal

2-4

1-3 & 2-4

Host chip reset circuit / button

Reset circuit / button or USB port A RTS

5.2 Serial Interfaces

USB port A is intended, by default, to be used for programming of the Host chip using the

arrayForth Interactive Development Environment (IDE). Transmit and receive lines may

be connected to async boot node 708 by insertion of jumpers in J23. Reset from port A

may be connected as shown above. Port B is primarily intended to be used for a serial

interface to the eForth or polyFORTH system; it too may be connected to nodes 100 and

200 by insertion of jumpers in J23. The mapping in J23 is as follows:

USB

port

J23

pins

Host

pins

USB

port

J23

pins

Host

pins

USB

port

J23

pins

Target

pins

Signal

Rx to

chip

Tx

1

2

708.17

5

6

200.17

9

10

708.17

A

B

C

from

chip

3

4

708.1

7

8

100.17

11 12

708.1

10

DB003 Evaluation Board Reference for EVB001

5.3 SPI Bus and Devices

Node 705 of the host chip is equipped with ROM capable of booting from an external flash memory using the 4-wire

SPI interface. Using jumper options, node 705 may be configured to boot from the onboard flash chip. It may also be

configured to selectively use other SPI devices under control of node 600 and/or external logic you provide. One

option that is explicitly supported is selection of either the SPI flash or a 1.8v MMC card in the SD card socket provided

with the board, under program control. Jumpers may also be used to completely disconnect node 705 from any of

these things so its four pins are free for other application use.

5.3.1 SPI Flash and Booting

Jumper block J25 controls SPI flash chip reset and booting options according to the

following table:

J25 pins

Don't

Care

J26 pins

IN

Configuration

Pulls Node 705 pin high. Node 705 does not

attempt boot nor does it drive any of its pins.

Node 705 attempts reading flash and if validity

checks pass it processes boot frame(s) from that

device.

Don't

Care

OUT

J25

1

2

J26

Flash chip is held in reset; all its pins are at high

impedance so that node 705's pins are available

for other use.

1

2

Don't

Care

1-2

2-3

3

Flash chip is reset by the Host chip's reset

circuit/button and, if both J20 jumpers are

inserted, by USB port A RTS.

Don't

Care

Evaluation boards are shipped with a high-level virtual machine set to boot from flash. New software is initially loaded

into flash using the arrayForth IDE; the procedure for doing this requires use of J26.

For other uses of the flash by software packages such as eForth and polyFORTH, and for software installation

procedures, see the documentation for each software package..

For low-level application use, see arrayForth source code and application notes.

5.3.2 MMC Card Mass Storage

The SD card socket also accepts MMC cards, and because dual voltage MMC cards support 1.8v VDD and signaling logic

levels, such cards may be directly controlled by the GA144. polyFORTH is configured by default to make use of such an

MMC card as mass storage, and the board's jumpers are set by default to enable this. The MMC card may be used for

backup, data logging, and transport of code or data between evaluation boards or other computers.

5.3.3 Enabling MMC Card Selection

J39

1

2

J37

Two jumper blocks configure simple external circuitry for selecting

between multiple SPI devices on the 4-wire bus controlled by node

705. The standard configurations are as follow:

1

3

2

4

3

J39 pins

2-3

J37 pins

1-2, 3-4

Configuration

SPI Flash is always selected. Node 600 unused.

Node 600 selects SPI flash when its pin is low (reset

condition), or MMC card when the pin is high.

1-2

1-2, 3-4

11

DB003 Evaluation Board Reference for EVB001

5.3.4 Connecting MMC Power and Signals to SD Socket

The selection logic described in section 5.3.3 drives signals that terminate in J40

near the SD card socket, along with 1.8v for V_DDon MMC cards. To configure the

SD socket to use these signals and power a dual voltage MMC card, install five

jumpers between each pin of J40 and the corresponding pin of J38.

5.4 SRAM

The external SRAM may be used with the virtual machines supporting high level

languages, in which SRAM control software is inherently present, or it may be

used directly by F18 applications. In the latter case, one option is to employ the SRAM control cluster (four nodes)

supplied with arrayForth. Alternatively you may write your own. No optioning nor interface circuitry is needed; probe

points are provided to facilitate I/O software development.

5.5 Connections to Target

Host SERDES node 701 is hardwired to Target node 001 with probe points. This connection may be used for

programming or otherwise communicating with the Target, to evaluate the SERDES, and to explore and develop

protocols.

Host node 500 drives a signal that connects to the jumper block as one source of reset signal for the Target chip.

Host node 300 may be connected to Target node 300; this allows the Host to boot the Target using 2-wire synchronous

protocol.

5.6 Summary of Host Pin Usage

Although many Host pins are committed to SRAM control, a good number remain available for application use.

5.6.1 Committed by Layout

All 40 pins of nodes 7, 8 and 9 are committed to SRAM control. Only four of these lines are available for probing.

SERDES lines from node 701 are committed to Target communication.

5.6.2 Uncommitted

All ten Analog I/O pins are uncommitted, as are the GPIO pins of nodes 217, 317, 417,

517 and 715. These 15 pins are available on hole patterns J21 and J27.

Node 001.1 and .17 (SERDES data and clock) are available at SMA patterns J74 and J75 respectively.

5.6.3 Conditionally Available

Nodes 100 and 200 are committed only if eForth or polyFORTH is used; otherwise their GPIO pins are available. All of

the pins in this section are accessible at plated through holes or at jumper blocks.

Node 300 has two GPIO pins which are available unless you require them for Target communication.

Node 500 has one GPIO pin that's available unless you need to use it for Target reset.

Node 600 has one GPIO pin that's available if you are not using the MMC card option.

Node 705 has four GPIO pins that are committed for SPI bus control, but if that is not needed the SPI chips can be

disabled and all four pins are available. (Pin 17 must still be pulled high if you wish to prevent boot validity check when

the chip is reset.)

Node 708 is normally used for arrayForth IDE but if not required these are available for asynchronous boot or any other

desired use.

12

DB003 Evaluation Board Reference for EVB001

6. Target Chip

The Target chip, designated chip 1 on some of the design

documentation, is configured in such a way that it may be

booted and debugged, but otherwise all of its pins are

available for your application. One possible use is as an I/O or

computational expander for the Host chip. However the key

reason for providing the Target chip on this evaluation board is

to address your need to prototype a full application for a

dedicated GreenArrays chip without having to lay out a board

or disconnect a great deal of evaluation circuitry.

All but seven of the Target I/O pins are completely

uncommitted, and are available in hole patterns J30, J31, J32

and J36 as shown in the picture at right. Of those seven, all

but two may be disconnected with jumpers to isolate the

Target chip for use in a dedicated application prototype.

6.1 Reset Control

Target reset is configured using J22 to the left of the chip. The

three pins on the top edge of the header (2, 4 and 6) are

connected in parallel to the RESET- pin of the Target chip. The

other three pins are connected with reset sources that may be

J22

4

3

2

1

6

5

combined as a summing point. Pin 1 is connected to Host chip node 500; pin 3 is connected to

USB port C RTS- line (low when RS232 signal would be low); and pin5 is connected to the power-

on and pushbutton reset circuit for the Target chip.

6.2 Serial Interface

USB port C is available to be used for programming the Target chip using the arrayForth IDE. Transmit and receive lines

may be connected to async boot node 708 by insertion of jumpers 9-10 and 11-12 of J23 located above the J22 reset

control jumper, as shown earlier in section 5.2.

6.3 Host Chip Communications

As noted earlier, Host SERDES node 701 is hardwired to target node 001

with probe points as shown to the right.

Host node 300 may be connected with Target node 300 for booting or

other communications. This is enabled by inserting jumpers J34 and J35 to the right of the SERDES probe points.

13

DB003 Evaluation Board Reference for EVB001

7. Prototyping Area

Half of the evaluation board's area is available for

your use in building any desired circuitry. We have

made this as flexible as feasible for a broad range of

projects. The area is covered with patterns of plated

through holes to which you may solder components,

connectors, headers and so on as necessary. On the

grounds that it is simpler and easier to solder multi-

pin devices onto a board than it is to remove such

devices when they are in the way, we supply an

assortment of connectors and headers in a separate

bag for your use.

GreenArrays expects to use this evaluation board as

the primary platform for design exercises that will be

published on our website as Application Notes

suggesting ways to make good use of this area.

7.1 Plated-through Hole Grid

The large grid of plated through holes, on 0.1"

centers, gives almost unlimited flexibility in

breadboarding your circuits. The area is compatible

with many common technologies that may be used to attach components, interfaces, or expand the area further by

soldering 0.1" headers to the board in suitable patterns. These options will be expanded upon later.

7.2 Power, Ground and Signals

Hole patterns carrying the main 1.8v bus and common ground are

available surrounding the prototyping area. Other supply voltages

such as 3.3v from the FTDI chips or user supplied voltages from the J1

barrier strip must be hand wired, as must any other signals such as those from GA144 pins.

7.3 Convenience Circuits

For interfacing to devices with signal voltages other than the 1.8v native to the GA144,

there are six 8-bit bidirectional level shifter chips in the prototyping area. These are

Texas Instruments TXB0108 devices in RGY packages and for maximum flexibility none

of their pins are connected except ground (pin 11 and die attach paddle.) You may use

each of these chips to interface between 1.2 to 3.6v on the A port and 1.65 to 5.5v on

the B port by connecting suitable supply voltages to each of the chip's two V_CCpins.

In addition, there are four uncommitted 2-input, 1.8v CMOS logic gates available for your use. These are

located between the Host chip and the hole grid of the prototyping area. The table below identifies the

connections and gate types.

Inputs

Output

TP11

TP12

TP13

TP10

Gate Type

2-input NAND

2-input OR

TP4

TP5

TP7

TP9

TP3

TP6

TP8

TP2

14

DB003 Evaluation Board Reference for EVB001

7.4 Optional Connector Hole Patterns

Unpopulated hole patterns are provided along the edges of the prototyping area for various connectors. Some

connectors are supplied with the evaluation board so that you may solder in any that you require.

7.4.1 DB9 Connectors

To interface with RS-232 devices, there are two female

DB9 patterns. For your convenience, these are

equipped with minimalist RS232 interfaces that may be

used with our chips: Data receive and RTS signals are

simply connected to GA144 pins through current

limiting resistors, while data transmit is done with a pair

of inverting N transistors powered by the Data Terminal Ready (DTR) line from the RS232 device. If these circuits don't

do the trick, the components may be desoldered and direct connection made to the DB9 pins. Pins 1 of J54 and J59 are

received data going to the GA144, pins 2 are transmit from the GA144, and pins 3 are incoming RTS. The inactive state

of each of these RS232 lines is low.

7.4.2 General-Purpose LEDs

Located between the two DB9 patterns are four general-purpose LEDs, which may be turned on by

supplying them with 1.8 volts on the geometrically corresponding pin of the adjacent pattern J57.

7.4.3 VGA Connector

A pattern for a female 15-pin D shell provides the means for driving a

VGA display directly from the GA144. Terminating resistor networks

must be added if the device requires them.

7.4.4 USB Connector

To facilitate development of USB device hardware and software, provision is made for attaching a

USB type B receptacle to the prototyping area. Some interface circuitry will probably be needed.

7.4.5 RJ48 Connector

For development of 10baseT and perhaps other Ethernet interfaces, a

pattern is provided for an RJ48 receptacle. Like USB, we expect that

some minimal interface circuitry will be required as well.

7.4.6 Audio Connectors

For analog audio input/output development, up to three 3.5mm stereo TRS receptacles may be

soldered to patterns provided on the prototyping area.

7.4.7 SMA RF Connectors

At higher frequencies, RF connectors are more suitable

for carrying signals on and off the evaluation board.

Accordingly we provide five hole patterns for mounting

SMA connectors, chosen for their small size and ready

availability.

15

DB003 Evaluation Board Reference for EVB001

7.5 Optional use of SD socket

Although software being prepared for the evaluation board will be capable of taking

advantage of a dual voltage MMC card for various purposes, the board layout is

versatile enough to allow for development of code to access 3.3v SD cards as well.

To take advantage of this capability, you must arrange to supply the SD socket with

3.3v power and construct the circuitry needed to communicate with it using 3.3v

logic signals. All nine pins are available at the socket on J33 and J38, including two

handhake lines, V_DD, all four data lines, card-present and write-protect signals.

7.6 Expanding the Prototyping Area

As suggested above, the grid of holes on 0.1" centers facilitates the installation of female headers into which various

expansion devices may be plugged.

Schmartboard™ Products include small boards

which can connect various surface mount parts

to our prototyping area using 0.1" headers.

This is considerably simpler and more likely to

succeed than is "dead bugging" SMT

components.

As another example, by soldering double row

female headers appropriately in the

prototyping area, PC-104 boards may be

connected to the evaluation board. For

example, see WinSystems® Products which

include prototyping boards that could simply

enlarge the prototyping area, or peripheral

boards that could be used with level shifters.

Here is one possible placement of a 16-bit PC-104 connector and two views of a PC-104 board mounted on it:

16

DB003 Evaluation Board Reference for EVB001

8. Physical Documentation

This section includes signal tables, schematics and PCB layout artwork.

8.1 Bill of Materials

RefDes

Value

Type

Pins Qty Manufacturer

Supplier

Sup Part No.

C1

C4,C13,C20

C5 (for 0.1.1 layout only)

C6 (for 0.1.1 layout only)

C7

C8 (for 0.1.1 layout only)

C9,C10,C16,C21,C23,C27

C15

22uf-25V

4.7uf

0.22uf 10% 630v CAP_0805

0.47uf 50v 10% CAP_0805

470pf 5v

330pf 1Kv 5%

10nf

68uf-16V

0.1uF

CAP_0805

CAP_0603

2

1 SANYO

3

1

Caps Plus 25TQC22MV

Digi-Key

Mouser

Digi-Key

Mouser

Digi-Key

490-5421-1-ND

81-GRM55DR72J224KW01

399-3752-1-ND

PCC471BQCT-ND

598-MC22FF331J-F

478-1114-1-ND

CAP_0402

CAP_0805

CAP_0402

CAP_0805

CAP_0402

1

6

1 SANYO

20 Amer Tech Ceramics ATC

Caps Plus 16TQC68M

C2,C3,C11,C12,C14,C17-

C19,C22,C24-C26,C28-C35

ATC530L104KT16T

D1,D3,D5,D6,D8

FB1,FB2,FB3

J1

J2

J3,J9,J18

J10,J11,J14-J16,J25,J39

J20,J29,J37

J22

J26,J34,J35

J23

J38 plus J40

JP1

K1,K2

L1

Q1,Q2

1N3016

2

10

3

6

3

4

6

2

12

10

15

2

6

2

33

11

89

48

8

12

20

5 On Semiconductor Digi-Key

MBRA340T3GOSCT-ND

490-5247-1-ND

ED2616-ND

Ferrite Bead

TERMBLK10

PJ-002B

USB

CON3

3

1

Digi-Key

Mouser

Digi-Key

Newark

CP-002BH-ND

737-USB-B-S-RA

A26513-03-ND

A34977-02-ND

A34977-03-ND

A26513-02-ND

A34977-06-ND

A34977-05-ND

69R4862

3 Adam Tech

7 Break up 1x40

3 Break up 2x40

1 Break up 2x40

3 Break up 1x40

1 Break up 2x40

1 GCT

HEADER_2X2

HEADER_2X3

HEADER_1X2

HEADER 2X6

HEADER 2X5

SD Connector

SWITCH_PB

Inductor

Dual 50v N-FET

RES_0603

RES_1206

RES_0805

FT232RQ

C1-RST

3.3uH

1

Digi-Key

Coilcraft

Digi-Key

P10877S-ND

1 COILCRAFT

2 Diodes, Inc.

1 Panasonic

2 Panasonic

4 Panasonic

6 Panasonic

2 Vishay/Dale

2 Panasonic

3 FTDI

MSS1048-332NLC

DMN5L06DMKDICT-ND

P15KGCT-ND

P100KGCT-ND

P127KHCT-ND

P18.2KHCT-ND

P68.1KHCT-ND

P10KGCT-ND

P1.0KGCT-ND

P5.1KGCT-ND

541-470UACT-ND

P2.7KADCT-ND

768-1008-1-ND

LT3480EMSE#PBF-ND

R2

R4

R5

R7

15K 10%

100K

127K 1%

18.2K 1%

68.1K 10%

10K

R9

R12,R15

R13,R14,R16,R17

R18,R19,R20,R21,R28,R29

R22,R30

R23,R31

U1,U3,U4

U2

U5,U8

U6

U7

1K

5.1K

470 1/2W

2.7K 1/4W

USB Serial

Regulator

Multicomputer

SRAM

SPI Flash

Quad OR

Quad NAND

LT3480

GA144

CY62167EV18LL-55

SST25WF080

74LVC32 QFN

74LVC00 QFN

1 Linear Technology Digi-Key

2 GreenArrays

1 Cypress

1 Microchip

1

GreenArrays G144A12

Avnet

Microchip

Digi-Key

Mouser

CY62167EV18LL-55BVXI

SST25WF080-75-4I-SAF

568-3017-1-ND

771-LVC00ABQ115

595-TXB0108RGYR

U9

U10

U11-U16

Octal Levelshift TXB0108E

6 Texas Instruments Mouser

106

28 Jameco Valuepro

TOTAL ASSEMBLED

2pin Jumpers

DB9F

USB "B" female

RJ48 Ethernet

3.5mm Phone Jack

Clip leads

Jameco

Mouser

Digi-Key

Mouser

19141

J52,J58

J71

J69

9

6

8

4

1 TE Connectivity

1 Adam Tech

1 TYCO

571-5747844-4

737-USB-B-S-RA

A31442-ND

161-4033-E

J62,J63,J64

3 KOBICONN

2 Circuit Specialists CircuitSpec

USB Cable

1

5

1

Monoprice

Jameco

LED green 565nm T1 3/4

Res CF 47ohm 1/4w 5%

HEADER 2X40

HEADER 1X40

334086

690540

117197

160882

1

1 Kingston

2GB

MMC DV Flash

Price Angels 73297

TOTAL IN BAG

50

17

DB003 Evaluation Board Reference for EVB001

8.2 GA144 Signal map

These tables identify header pins or holes at which each chip's signals may be found.

8.2.1 Host Chip

Type

Name

d00

d01

d02

d03

d04

d05

d06

d07

d08

d09

d10

d11

d12

d13

d14

d15

d16

d17

1

2

3

8

Access

D00

Description

9

10

11

12

13

16

21

22

23

24

25

30

31

32

Bits 0 through 17 of node 007 UP port.

General purpose bidirectional parallel bus.

None

SRAM Data

Bus

Bits 0 through 15 are connected to the SRAM BGA and probe access is not

supported except for bit 0 to probe timing. Mapping to SRAM data lines is

randomized for best layout.

Bits 16 and 17 are pulled down so that they will read as zero.

R14

R13

008.17

008.5

008.3

008.1

a17

a16

a15

a14

a13

a12

a11

a10

a09

a08

a07

a06

a05

33

34

35

36

37

38

39

42

43

44

45

46

53

54

55

56

57

58

65

66

67

68

None

General purpose 4-pin node used for SRAM control (1,3) and high order

address lines (5,17). Pins 1 and 3 are pulled up so that the SRAM is made

inactive when chip is reset.

GPIO

WE-

CE-

Bits 17 through 0 of node 009 UP port.

General purpose bidirectional parallel bus.

None

SRAM

Address Bus

Bits 0 through 17 are connected to the SRAM BGA and probe access is not

supported except for bit 0 to probe timing. Mapping to the low order 17

SRAM address lines is randomized for best layout. A17 must be mapped

directly so that the layout will accommodate chips with 128k or fewer words.

a04

a03

a02

a01

a00

A00

18

DB003 Evaluation Board Reference for EVB001

001.17

001.1

701.17

701.1

300.17

300.1

708.17

708.1

27

26

86

87

14

15

78

79

85

84

81

80

20

18

7

J75

J74

S17

Node 001 Clock

Node 001 Data

Node 701 Clock

Node 701 Data

SERDES

GPIO

Available at dedicated SMA connector hole patterns..

Connected to Target node 001 SERDES. Both chips reset to

SDERDES boot.

S1

J35.1

J34.1

J23.2

J23.4

DI

DO

SS-

SCK

J23.8

J23.6

J22.1

J39.1

J21.5

J21.4

J27.3

J27.2

J27.4

J27.5

J27.8

J27.7

Sync clock

Sync data

Rx Input

Tx Out

General purpose 2-pin node. ROM supports synchronous boot.

May be connected to Target node 300.

General purpose 2-pin node. ROM supports asynchronous

boot. May be connected to USB port A for IDE operations.

GPIO

705.17

705.5

705.3

Data In

General purpose 4-pin node. Normally used for boot and/or

read/write on SPI Flash and/or mass storage such as MMC

depending on jumpers. May also be free for application use.

When MMC selected, SS- and other signals are on J40.

Data Out

Chip Enable-

Clock

GPIO

705.1

100.17

200.17

500.17

600.17

317.17

417.17

709.ai

709.ao

713.ai

713.ao

717.ai

717.ao

1-pin GPIO nodes. May be connected to USB port B for use with high level

Virtual Machines.

1-pin GPIO node. May be used to reset the Target chip.

1-pin GPIO node. May be used in selecting expanded SPI bus.

6

52

59

76

77

73

72

69

70

1-pin GPIO nodes. Available for application use.

Analog In

Analog Out

Analog In

Analog Out

Analog In

Analog nodes whose I/O is powered by separate V_DDA bus. Available for

application use.

Analog Out

General purpose 1-pin node whose pin is shared (read only) by the above

analog nodes and may be used by them for timing or other purposes.

GPIO

715.17

71

J27.6

Analog In

Analog Out

GPIO

Analog In

Analog Out

GPIO

617.ai

617.ao

517.17

117.ai

117.ao

217.17

RESET-

61

63

60

48

50

51

88

5

J21.2

J21.1

J21.3

J21.8

J21.7

J21.6

J20.1

Analog node whose I/O is powered by V_DDI bus.

General purpose 1-pin node whose pin is shared (read only) by Analog 617.

Analog node whose I/O is powered by V_DDI bus.

General purpose 1-pin node whose pin is shared (read only) by Analog 117.

Reset signal, active low. Also pin J20.2.

Input

17

29

41

49

62

75

83

4

19

28

40

47

64

82

74

Core power bus. Powers F18A computers, and parts of I/O circuitry (such as

registers) that are internal to them.

Power

V_DD

C

J10.2

I/O power bus. Powers I/O pads including the parts of the I/O circuitry

collocated with the pads. Includes analog pads for nodes 117 and 617.

V_DD

I

J11.2

Power

V_DDA

Analog power bus for pads of nodes 709, 713 and 717.

Ground

GND

DAP any gnd Common ground and heat sink.

19

DB003 Evaluation Board Reference for EVB001

8.2.2 Target Chip

Type

Name

Access

Description

d00

d01

d02

d03

d04

d05

d06

d07

d08

d09

d10

d11

d12

d13

d14

d15

1

2

3

8

J30.1

J30.2

J30.3

J30.6

J30.7

J30.8

J30.9

J30.10

J30.11

J30.12

J30.15

J30.16

J31.1

J31.2

J31.3

J31.4

J31.5

J31.6

J31.7

J31.8

J31.9

J31.10

J31.11

J31.12

J31.13

J31.14

J31.15

J31.16

J36.15

J36.14

J36.9

J36.8

J36.7

J36.6

J36.5

J36.4

J32.15

J32.14

J32.13

J32.12

S17

9

10

11

12

13

16

21

22

23

24

25

30

31

32

33

34

35

36

37

38

39

42

43

44

45

46

53

54

55

56

57

58

65

66

67

68

27

26

86

87

14

15

Bits 0 through 17 of node 007 UP port.

Bus I/O

General purpose bidirectional parallel bus, such as external memory data.

d16

d17

008.17

008.5

008.3

008.1

a17

a16

a15

a14

a13

a12

a11

a10

a09

a08

a07

a06

a05

General purpose 4-pin node.

Might be used for memory or bus control and handshake lines.

GPIO

Bits 17 through 0 of node 009 UP port.

Bus I/O

General purpose bidirectional parallel bus, such as external memory address.

a04

a03

a02

a01

a00

001.17

001.1

701.17

701.1

300.17

300.1

Node 001 Clock

Node 001 Data

Node 701 Clock

Node 701 Data

Connected to Host node 701 SERDES. Both chips reset to

SDERDES boot.

SERDES

GPIO

S1

J28.2

J28.4

J35.2

J34.2

Available for experimentation.

Sync clock

Sync data

General purpose 2-pin node. ROM supports synchronous boot.

May be connected to Host node 300.

20

DB003 Evaluation Board Reference for EVB001

708.17

708.1

705.17

705.5

705.3

705.1

100.17

200.17

500.17

600.17

317.17

417.17

709.ai

709.ao

713.ai

713.ao

717.ai

717.ao

78

79

J23.10 Rx Input

J23.12 Tx Out

General purpose 2-pin node. ROM supports asynchronous

boot. May be connected to USB port C for IDE operations.

GPIO

85

84

81

80

20

18

7

J32.1

J32.2

J32.3

J32.4

J30.14

J30.13

J30.5

J30.4

J36.10

J36.3

J32.6

J32.5

J32.7

J32.8

J32.11

J32.10

Data In

General purpose 4-pin node. If 705.17 is low on reset, ROM

will attempt SPI memory boot using signal assignments

shown, driving signals on 705.5, 3, 1, and will leave these in

output mode unless programmed otherwise.

Data Out

Chip Enable-

Clock

General purpose 1-pin nodes.

No special ROM or interconnections.

GPIO

6

52

59

76

77

73

72

69

70

Analog In

Analog Out

Analog In

Analog Out

Analog In

Analog nodes whose I/O is powered by separate V_DDA bus.

Analog Out

General purpose 1-pin node whose pin is shared (read only) by the above

analog nodes and may be used by them for timing or other purposes.

GPIO

715.17

71

J32.9

Analog In

Analog Out

GPIO

Analog In

Analog Out

GPIO

617.ai

617.ao

517.17

117.ai

117.ao

217.17

RESET-

61

63

60

48

50

51

88

5

J36.1

J32.16

J36.2

J36.13

J36.12

Analog node whose I/O is powered by V_DDI bus.

General purpose 1-pin node whose pin is shared (read only) by Analog 617.

Analog node whose I/O is powered by V_DDI bus.

J36.11 General purpose 1-pin node whose pin is shared (read only) by Analog 117.

J22.2

Input

Reset signal, active low. Also pins J22.4 and 6.

17

29

41

49

62

75

83

4

19

28

40

47

64

82

74

Core power bus. Powers F18A computers, and parts of I/O circuitry (such as

registers) that are internal to them.

Power

V_DD

C

J14.2

I/O power bus. Powers I/O pads including the parts of the I/O circuitry

collocated with the pads. Includes analog pads for nodes 117 and 617.

V_DD

I

J15.2

J16.2

Power

V_DDA

Analog power bus for pads of nodes 709, 713 and 717.

Ground

GND

DAP any gnd Common ground and heat sink.

21

DB003 Evaluation Board Reference for EVB001

8.3 Connector Pinouts

8.3.1 Power Control Section

J15

1

External Connector

External Target Pwr

Pin 1 of J1 is oriented toward the bottom edge of the

board and thus is an exception to the rule.

2

3

V_DDI to Target

Main 1.8v Bus

J1

J16

1

10 Gnd

External Target Pwr

9

8

7

6

5

4

3

2

User supply, J4

Gnd

User supply, J5

Gnd

User supply, J6

Gnd

External Host Pwr

Gnd

2

3

V_DDA to Target

Main 1.8v Bus

8.3.2 USB Serial Interfaces

Port Data Connections to Host and Target

J23

1

External Target Pwr

Incoming from Port A

1

2

Host 708.17

Outgoing to Port A

Incoming from Port B

Outgoing to Port B

3

5

7

9

4

6

8

Host 708.1

Host 200.17

Host 100.17

Single Pins

J4 User supply, J1.9

J5 User supply, J1.7

J6 User supply, J1.5

Incoming from Port C

10 Target 708.17

Outgoing to Port C 11 12 Target 708.1

Port A Access

Host Power Select

J7 FTDI 3.3v Pwr

J8

J10

1

2

3

External Host Pwr

V_DDC to Host

Main 1.8v Bus

1

DTR signal

2

3

4

CBUS2

CBUS3

CBUS4

J11

1

2

3

External Host Pwr

V_DDI and A to Host

Main 1.8v Bus

Port B Access

J12 FTDI 3.3v Pwr

J24 RTS signal

Target Power Select

J14

J13

1

External Target Pwr

1

DTR signal

2

3

V_DDC to Target

Main 1.8v Bus

2

3

4

CBUS2

CBUS3

CBUS4

22

DB003 Evaluation Board Reference for EVB001

Port C Access

J19 FTDI 3.3v Pwr

Uncommitted Host Pins

J21

1

617.ao

J17

2

3

4

5

6

7

8

617.ai

517.17

417.17

317.17

217.17

117.ao

117.ai

1

2

3

4

DTR signal

CBUS2

CBUS3

CBUS4

8.3.3 Host Chip

Probe Points

J27

1

Ground

CE-

SRAM chip enable from 008.1

2

3

4

5

6

7

8

709.ao

709.ai

713.ai

713.ao

715.17

717.ao

717.ai

WE- SRAM write enable from 008.3

D00 SRAM data bit

A00

SS-

SRAM address bit

Chip select for SPI Flash chip

Clock line for SPI bus (selectively

enabled to the SD socket)

SCK

DO

DI

Data out bus from G144 to SPI devices

Data in bus from SPI devices to G144

8.3.4 Target Chip

Reset and Boot

Probe Points

J20

S17

S1

SERDES Clock between Host and Target

SERDES Data

Host RESET pin

1

3

2

4

Host RESET pin

USB A RTS signal

Host reset ckt & J25.3

Reset and Host Communication

J25

J22

1

2

3

Ground

Host 500.17

1

2

SPI Flash RST- pin

Host reset ckt & J20.4

Target RESET- pin

USB C RTS signal

Target reset circuit

3

5

4

6

J26

1

J35

Host 705.17

1

2

Host 300.17

2

1K Pull-up to 1.8v

Target 300.17

SPI Bus Expansion

J34

1

J39

Host 300.1

1

2

3

Host 600.17

2

Target 300.1

FLASHENABLE-

Ground

J37

1

3

2

4

FLASHENABLE-

on SPI bus.

2 inputs to NAND. Output

low enables MMC on SPI bus.

23

DB003 Evaluation Board Reference for EVB001

Uncommitted Target Pins

8.3.5 Prototyping Area

J30

SD/MMC Socket Signals

d00

1

2

d01

SD Socket signals

J38 J40 SPI Bus signals

d02

500.17

d04

3

5

7

9

4

6

8

600.17

d03

d05

CLK/SCLK

DAT3/CS-

CMD/SI

DAT0/SO

V_DD

1

2

3

4

5

1

2

3

4

5

SPI CLK MMC

SPI CS- MMC

SPI DO

SPI DI

1.8v

d06

10 d07

12 d09

14 100.17

16 d11

d08 11

200.17 13

d10 15

J33 SD Socket Signals

1

DAT1

J31

J32

J36

J28

2

3

4

DAT2

Card Present

Write Protect

d12

d14

d16

1

3

5

7

9

2

4

6

8

d13

d15

d17

008.5

008.17

008.3

TI TXB0108 Level Shifterss

Each level shifter is surrounded by this hole pattern:

10 008.1

12 a16

14 a14

16 a12

a17 11

a15 13

a13 15

A2 V_CCA A1

B1

V_CCB B2

A3

A4

A5

A6

B3

B4

B5

B6

705.17

1

2

4

6

8

705.5

705.1

709.ai

713.ao

705.3

709.ao

713.ai

715.17

717.ai

3

5

7

9

11

10 717.ao

12 a00

14 a02

A7

A8

OE V_SS

B8

B7

a01 13

a03 15

16 617.ao

Convenience Logic

TP4

TP5

TP11

TP6

TP7

TP12

TP8

TP9

TP13

TP2

NAND 1 Input

NAND 1 Output

NAND 2 Input

NAND 2 Output

NAND 3 Input

NAND 3 Output

OR Input

617.ai

1

3

5

7

9

2

4

6

8

517.17

a04

a06

417.17

a05

a07

a09

a08

10 317.17

12 117.ao

14 a10

217.17 11

117.ai 13

a11 15

16 Ground

TP3

OR Input

1

2

4

701.17 SERDES clock

701.1 SERDES data

TP10

OR Output

Ground

3

24

DB003 Evaluation Board Reference for EVB001

RJ48 site (J69)

DB9 RS232 site Left (J52)

J66

1

J54

TX+

1

RX Incoming

2

3

4

5

TX-

RX+

RX-

n/c

2

3

TX Outgoing

RTS Incoming

Note these signals are on chip side of minimal

quasi-RS232 transceiver.

Audio site (J62, 63, 64)

General Purpose LEDs

J65

J57

1

RING

V_DDfor D12

2

3

4

NC TIP SWITCH

TIP

SLEEVE

2

3

4

V_DDfor D13

V_DDfor D14

V_DDfor D15

J60

1

DB9 RS232 site Right (J58)

RING

J59

2

3

4

NC TIP SWITCH

TIP

SLEEVE

1

RX Incoming

2

3

TX Outgoing

RTS Incoming

J61

1

Note these signals are on chip side of minimal

quasi-RS232 transceiver.

RING

2

3

4

NC TIP SWITCH

TIP

SLEEVE

VGA site (J70)

J67

1

RED

SMA RF site (J41, 49, 51, 55)

2

3

4

5

6

GREEN

BLUE

HSYNC

VSYNC

gnd

J48

1

2

J41 Signal

Gnd

J50

1

USB site (J71)

J49 Signal

Gnd

2

J68

1

V_CC

D+

D-

J53

1

2

3

J51 Signal

Gnd

2

J56

1

J55 Signal

Gnd

25

DB003 Evaluation Board Reference for EVB001

8.4 Errata

Known problems at the time of this writing are as follow:

PCB REV

DESCRIPTION

FIX OR WORK-AROUND

The VGA connector hole pattern J70 is rotated 180

degrees. Ground pins are connected

Do not use J70. The pattern and wiring will be

corrected in the next board revision.

0.1.1

inappropriately and connector is physically

impractical to use when pointed inward.

The FTDI transmit and receive LEDs are not

populated due to an error in circuit design.

The general purpose LEDs (see J57) are not

populated due to an error in circuit design.

Do not use. Circuit and layout will be corrected in

the next board revision.

Do not use. Circuit and connectors will be changed

in the next board revision.

0.1.1

8.5 Schematics and Layout

The following nine pages may be used to print or view high resolution renderings of these graphics.

Status of artwork: These are production drawings.

26

DB003 Evaluation Board Reference for EVB001

9. Data Book Revision History

REVISION

DESCRIPTION

110726

Preliminary release with pre-production drawings.

Upgrade document status to Production reflecting board revision 0.1.1. Added details in Power

Configuration section (3). Added table showing FTDI flash configuration (4.3). Corrected Target pin

connections to J32 in 8.1.2 and 8.2.4. Clarified jumper table in 8.2.2. Added Errata. Updated schematics

and layout to Production. Added Bill of Materials. Various typos.

110926

35

GreenArrays^™

Product Data Book DB003 Revised 9/26/11

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